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The is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.

TIE is part of the at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation's most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin - named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report - the Cockrell School embodies the city's innovative spirit. Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders.

At UT Austin, we say "What starts here changes the world." As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research. Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs.

UT Austin, recognized by Forbes as one of , provides outstanding and packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)

• Voluntary Vision, Dental, Life, and Disability insurance options

• Generous paid vacation, sick time, and holidays

• Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds

• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)

• Flexible spending account options for medical and childcare expenses

• Robust free training access through LinkedIn Learning plus professional conference opportunities

• Tuition assistance

• Expansive employee discount program including athletic tickets.

• Free access to UT Austin's libraries and museums with staff ID card

• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

Multiple vacancies are available. This position may be filled at a higher-level title, relative to the experience and qualifications of the selected candidate. Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship. Relocation assistance may be available.

Provides professional expertise to the Texas Institute for Electronics in one of the following focus areas: Product Validation; Product Test and/or BIST (Built-In-Self-Test). DFT/DFM (Design for Test / Design for Manufacturing); Product Reliability; or Failure Analysis, Yield Improvement, Data analytics.Responsible for optimizing manufacturing processes to improve 3DHI yield, performance, & reliability of a wide range of customer heterogenous micro-systems and test vehicles. Work closely with design teams to define and create test structures and methodologies to drive our product objectives as we build up our 3DHI manufacturing facility our country can rely upon.

• Micro-system and interconnect process development test vehicle electrical, mechanical, and thermal validation.

• Help develop manufacturing & test workflows, 2.5D/3D modeling methods, BKM's (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.

• Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices.

• Develop and support TIE's 3D-ADK (Assembly Design Kit).

• Interpret fab metrology, defect, E-test, and yield process data, silicon-to-simulation analysis versus variability targets, layout effects, design rule assessments, and product parametric correlation to electrical monitor structures to find innovative product/process solutions and optimize product yield, performance, and reliability.

• Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements.

• Design and execute experiments to evaluate and optimize packaging performance, reliability, and manufacturability/yield.

• Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement.

• Product Engineer I: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field.

• Product Engineer II: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field and a minimum of three years of relevant industry experience.

• Senior Product Engineer: Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or related field and a minimum of ten years of relevant industry experience.

• Strong understanding of semiconductor device physics

• Experience driving corrective actions across cross-functional teams to fix and root-cause systematic yield and reliability issues.

• Excellent analytical and problem-solving skills, as well as attention to detail

• Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.

• Ability to thrive in a fast-paced environment and manage multiple projects simultaneously.

• Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level packaging, and 3D integration a plus

• Prior experience in semiconductor design, product engineering, manufacturing, Test, or packaging a big plus.

• Experience conducting data analysis of foundry WAT data, ATE test data using tools like JMP, Python, C+/+ etc a plus.

Relevant education and/or industry experience may be substituted as appropriate.

• Master's degree or Doctoral degree in semiconductor engineering fields such as Electrical Engineering, Chemical Engineering, Materials Science, or other relevant disciplines.

• Prior experience in semiconductor design, product engineering, manufacturing, Test, or packaging.

• Strong programming skills in languages such as Python, MATLAB, or C/C++ for simulation, data analysis, and automation.

• Experience in a startup or research and development (R&D) environment.

• Product Engineer I: $80,000 + depending on qualifications

• Product Engineer II: $100,000 + depending on qualifications

• Senior Product Engineer: $160,000 + depending on qualifications

• Work is performed on-site in a scientific research environment, with dynamic work conditions and frequent interruptions.

• Work outside standard office hours could be required on an occasional basis during peak periods and special events.

• Resume/CV

• 3 work references with their contact information; at least one reference should be from a supervisor

• Letter of interest

Important for applicants who are NOT current university employees or contingent workers: You will be prompted to submit your resume in the first step of the online job application process. Then, any additional Required Materials will be uploaded in the My Experience section; you can multi-select the additional files or click the Upload button for each file. Before submitting your online job application, ensure thatALLRequired Materials have been uploaded. Once your job application has been submitted, you cannot make changes.

Important for Current university employees and contingent workers: As a current university employee or contingent worker, you MUST apply within Workday by searching for Find Jobs. Before you apply though, log-in to Workday, navigate to your Worker Profile, click the Career link in the left hand navigation menu and then update the sections in your Professional Profile. This information will be pulled in to your application. The application is one page and you will need to click the Upload button multiple times in order to attach your Resume, References and any additional Required Materials noted above.

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Employment Eligibility:

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Retirement Plan Eligibility:

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Background Checks:

A criminal history background check will be required for finalist(s) under consideration for this position.

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Equal Opportunity Employer:

The University of Texas at Austin, as an ,complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

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Pay Transparency:

The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor's legal duty to furnish information.

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Employment Eligibility Verification:

If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

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E-Verify:

The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university's company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following:

• [PDF]
• [PDF]
• [PDF]
• [PDF]

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Compliance:

Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act). If this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in .

The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.